Details zur Publikation

Kategorie Textpublikation
Referenztyp Zeitschriften
DOI 10.1002/(SICI)1521-4109(199902)11:2<101::AID-ELAN101>3.0.CO;2-V
Titel (primär) Voltametric detection of DNA interaction with copper complex compounds and damage to DNA
Autor Labuda, J.; Bučková, M.; Vanickova, M.; Mattusch, J.; Wennrich, R.
Quelle Electroanalysis
Erscheinungsjahr 1999
Department ANA
Band/Volume 11
Heft 2
Seite von 101
Seite bis 107
Sprache englisch
Keywords copper complex;calf thymus DNA;DNA modified electrode;biosensor;chemical nuclease;damage to DNA
Abstract

Binding reactions of copper(II) complexes of 1,10-phenanthroline (phen) and tetraaza macrocyclic ligand TAAB with calf thymus DNA have been investigated voltammetrically at bare and DNA modified glassy carbon electrodes. The values of binding constant, binding site size, ratio of binding constants for the reduced and oxidized copper complex forms as well as information on the electrostatic and intercalative binding modes were obtained by solution and surface-based methods. The Cu(phen)22+complex mediates the dsDNA cleavage to a higher degree than Cu(TAAB)2+as indicated by the redox marker Co(phen)33+and the anodic signal of the DNA base. A procedure for the damage to DNA detection using dsDNA/GCE biosensor is proposed.

dauerhafte UFZ-Verlinkung https://www.ufz.de/index.php?en=20939&ufzPublicationIdentifier=8173
Labuda, J., Bučková, M., Vanickova, M., Mattusch, J., Wennrich, R. (1999):
Voltametric detection of DNA interaction with copper complex compounds and damage to DNA
Electroanalysis 11 (2), 101 - 107 10.1002/(SICI)1521-4109(199902)11:2<101::AID-ELAN101>3.0.CO;2-V